Rogers 3003 HDI Pcb , Rf Electronics Multilayer Printed Circuit Board 1.5mm Thickness
Key Specifications/Special Features:
Specification:
Board material: rogers 3003
Layer count: 4L
Board thickness: 1.5mm
Min hole size: 0.1mm
Min track width/space: 0.2mm/0.2mm
Copper thickness: 1oz
Solder mask: black/blue/green
Silkscreen: white
Surface finishing: Immersion Gold
Testing procedures for PCB board:
We perform multiple quality assuring procedures
before shipping out any PCB board. These include:
Visual Inspection
Flying probe
Impedance control
Solder ability detection
Digital metallogenic microscope
AOI (Automated Optical Inspection)
Quotation requirement:
Following specifications are needed for quotation:
Quantity
Base material
Board thickness
Copper thickness
Surface treatment
Color of solder mask and silkscreen
Shipping method and payment terms:
By DHL, UPS, FedEx, TNT using clients account.
DHL, UPS, FedEx, TNT forwarder of China.
We could ship the parcel by Russia Special Air Line for Russian customer
(No tax in your there, 3 - 10 days to Moscow , 15-20 days to other city)
By sea or air for mass quantity according to customer's requirement.
By customer's Forwarder
Payment by PayPal, T/T, Western Union, and more.
Parameter:
o Item Data
1 Layer: 1 to 24 layers
2 Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness:0.20mm to 3.4mm
4 Copper thickness:0.5 OZ to 4 OZ
5 Copper thickness in hole:>25.0 um (>1mil)
6 Max. Board Size:(580mm×1200mm)
7 Min. Drilled Hole Size:4mil(0.1mm)
8 Min. Line Width:3mil (0.075mm)
9 Min. Line Spacing:3mil (0.075mm)
10 Surface finishing:HASL / HASL lead free, HAL, Chemical tin,
Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12 Shape tolerance:±0.13
13 Hole tolerance:PTH: ±0.076 NPTH: ±0.05
14 Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate:UL,SGS,ISO 9001:2008
16 Special requirements:Buried and blind vias+controlled impedance +BGA
17 Profiling:Punching, Routing, V-CUT, Beveling
Applications:
Amplifier Combiner Coupler Mixer Multiplexer Power divider WiFi
WiMAX, LTE bands 3G and 4G antenna
Typical Applications:
- Space Saving Circuitry
- Patch Antennas
- Satellite Communications Systems
- Power Amplifiers
- Aircraft Collision Avoidance Systems
- Ground Radar Warning Systems
- Datalink on cable systems
- Remote meter readers
- Power backplanes
- LMDS and wireless broadband
- Base station infrastructure
Parameter:
| o |
Item |
Data |
| 1 |
Layer: |
1 to 24 layers |
| 2 |
Material type: |
FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 |
Board thickness: |
0.20mm to 3.4mm |
| 4 |
Copper thickness: |
0.5 OZ to 4 OZ |
| 5 |
Copper thickness in hole: |
>25.0 um (>1mil) |
| 6 |
Max. Board Size: |
(580mm×1200mm) |
| 7 |
Min. Drilled Hole Size: |
4mil(0.1mm) |
| 8 |
Min. Line Width: |
3mil (0.075mm) |
| 9 |
Min. Line Spacing: |
3mil (0.075mm) |
| 10 |
Surface finishing: |
HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 |
Solder Mask Color: |
Green/Yellow/Black/White/Red/Blue |
| 12 |
Shape tolerance: |
±0.13 |
| 13 |
Hole tolerance: |
PTH: ±0.076 NPTH: ±0.05 |
| 14 |
Package: |
Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 |
Certificate: |
UL,SGS,ISO 9001:2008 |
| 16 |
Special requirements: |
Buried and blind vias+controlled impedance +BGA |
| 17 |
Profiling: |
Punching, Routing, V-CUT, Beveling |
Karen-Sales Department
ShenZhen Xinchenger Electronics Co.,Ltd
sales3@xcepcb.com
Skype:karen-xcepcb
Product Tags:
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Rogers 3003 HDI Pcb , Rf Electronics Multilayer Printed Circuit Board 1.5mm Thickness Images
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